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| SOI News Letter Januray 23 - April 23
Dear SOI Designer community member,
This SOI Designer News Letter highlights what was new in the SOI world within the 4 last months as identified by D&R. It aims at creating a live worldwide SOI Ecosystem, attracting more and more FD-SOI designers and thus triggering new successful Asic / SoC designs on this technology. In this report, the first section is dedicated to News that highlights recent SoC or design platform exhibiting the advantages of this technology. In a second part recent scientific contributions are listed. In a last part the key ingredient for Designers mainly the market available IP are reported. All Data reported here can be found at https://www.soi-forum.com/
This list of public available FD-SOI IP are collected, listed, and refreshed on https://www.soi-forum.com/ in the section "Market available FD-SOI IP". This list is synchronized with the D&R IP database. www.design-reuse.com Note that the FD-SOI target in the IP description has been claimed by the IP vendor under his sole responsibility. No proof of "silicon validation" has been afforded. It rather shows interest that the designers world brings to this technology. 271 FD-SOI IP from 34 vendors have been identified, targeting Samsung, GF, or ST foundry mainly in 3 categories : Foundation IP, Interface IP, application specific IP. Note that the majority of IP (namely 85%) targets GF 22FDx technology. The set of IP are partitioned into Foundation IP of major importance for a technology followed by higher level namely interface IP and finally application centric solution.
166 Foundation IP cover a variety of basic cells with a broad offer in basic cells standard cells which is good for new designers, followed by a focus on embedded power management IP (as power consumption is the major benefit of this technology) ahead of ADC/DAC, Embedded memories IP, etc.
51 IP from 9 vendors have been identified as Interface IP providers. Those are higher level IP are provided by experienced IP vendor namely : Analog Bits Inc., Dolphin Design, Innosilicon Technology Ltd, Mixel, Inc., Rambus, Inc., Renesas, Synopsys, Inc., T2M GmbH, VeriSilicon Microelectronics (Shanghai) Co., Ltd. MIPI and USB are the first targets followed by HDMI and DDR.
When going to a higher level solutions and as said above some the Application solution have not been Silicon proven; nevertheless they show that the process is on going and that this technology target has been chosen. 52 solutions are posted and it is interesting to see in which areas; 4 areas have addressed and the distribution is shown below.
4 vendors target this areas : Dolphin Design, Innosilicon Technology Ltd, T2M GmbH, VeriSilicon Microelectronics (Shanghai) Co., Ltd. Note that for modulator/demodulator T2M distinguishes the silicon proven and the validated one.
Wireline are proposed by 2 vendors (Innosilicon Technology Ltd, T2M GmbH) for ethernet IP and De/modulator. Wireless IP are proposed by 4 vendors (Extoll GmbH, Orca Systems Inc., T2M GmbH, VeriSilicon Microelectronics (Shanghai) Co., Ltd.) in the areas described below.
Solutions are proposed by 4 vendors namely Mixel, Inc., Siliconally, Synopsys, Inc., Weasic Microelectronics
Frontgrade Gaisler announces both a Noel-V processor but also an Octacore.
Only one solution proposed by Tiempo Secure and possibly under validation for now.
The SOI ecosystem is slowly under consolidation. This letter aims at establishing a bridge from technology progresses to the creation of market available existing design blocks or IP. In order to be comprehensive the participation all members of this ecosystem is key. So please send us recent missing data and more important any contributions (blog, white paper...) you would like to share with this community. Contact us.
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